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Surface Mount Technology (SMT)

  • Automated Screen Printing
  • Solder Paste Optical Inspection
  • Component placement
  • PCBA reflow
  • Automated Optical Inspection post reflow

Thru-Hole Technology (THT)

  • Automated component insertion for radial, axial and DIP components
  • Hand assembly for large mass components
  • Wave soldering machines

Cleaning Technologies

  • RO / DI water system
  • Water soluble wash
  • No-clean wash
  • Ionic testing

Typical Component Types Used In The SMT And THT Assembly Process

  • 01005, 0201, 0402, 0603, 0805, 1206, SMT packages
  • QFP, QFN, DFN, PLCC
  • Ball Grid Array (BGA), fine pitch / micro BGA
  • Axial, radial and DIP leaded components

Test And Inspection

  • AOI post screen printing and post relow
  • Custom fixtured In-Circuit Testing
  • Flying Probe In-Circuit Testing
  • X-ray
  • Functional test
  • Manual Inspection performed by IPC Certified inspectors

World Class Electronics